Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique
参考中译:UV-LIGA技术制造镍模具中SU-8结构的膨胀


          

刊名：Microsystem Technologies
作者：Luo Yi
Wang Xiaodong
Liu Chong
Lou Zhifeng
Chu Denan
Yu Dehui
刊号：737E0062
ISSN：0946-7076
出版年：2005
年卷期：2005, vol.11, no.12
页码：1272-1275
总页数：4
分类号：TP27
语种：eng
文摘：UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-pol-ished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the side walls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design.



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