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Investigation of the microwave curing of an epoxy resin system

作者：	Mark Wallace David Attwood Richard J. Day Frank Heatley
会议名：	The 12th International Conference on Composites Material (ICCM 1999)
会议日期：	1999
出版年：	1999
页码：	10pp
馆藏号：	273518
分类号：	TG5-53/S678+TB332
关键词：	Microwave curing；Reaction path；Thermal curing；Infrared spectroscopy；Epoxy resin
参考中译：
语种：	eng
文摘：	A commercial resin system, PR500 from 3M, has been cured using microwave heating. For comparison, the same resin has been cured using a conventional oven. The cured resins has been compared using modulated differential scanning calorimetry, dynamic thermal analysis, infrared spectroscopy and solid state NMR spectroscopy. The results show that the reaction path appears slightly different in the two cases. The epoxy-amine reaction occurs to a greater extent in the microwave cured resin than the epoxy-hydroxyl reaction compared to the thermally cured resin. The dielectric properties are not sensitive to this change. Broadening of the glass transition for microwave cured resins has been previously observed and attributed to a difference in network structure.